In late November, we saw the Exynos 8890, which will be premiered in the Galaxy S7, break the barrier of 100 000 points in AuTuTu, with an exact amount of 103,692 points. This achievement is really remarkable and makes it clear that in 2016 we will see great monsters reach the market in the form of smartphones. The S7 will feature a model with Snapdragon 820 chipset, which underwent some GeekBench tests, but now we see the new high-end product line of Qualcomm also be tested in AnTuTu.
This time, it was spotted the Xiaomi Mi 5 pass test in AnTuTu, it will come with the same chipset used by Samsung in S7, which helps us to see the performance of it. The good news is that the new SoC Qualcomm does not lack for Exynos 8890 to also break the barrier of 100 000 points – 101,339 to be exact. This shows that Qualcomm may regain its position in the market as the leading provider of cutting-edge components, leaving aside the problems that plagued the Snapdragon 810 this year.
These figures are truly amazing, but taking into account the latest list released by AnTuTu, Apple A9 is still the king with incredible 123,567 points. In the second, we see the Apple A8X it was the most powerful SoC apple before the arrival of new iPhones with its 98,901 points. The Kirin 950, new bet Huawei with Mate 8, is third with 92,746 points – followed by the Exynos 7420 used in the main flagship of South Korea this year. They are high numbers and that can excite, in theory, but does not confirm that these devices offer the best performance on a daily basis.
Going back to Xiaomi Mi 5, the novelty of the Chinese manufacturer will be revealed in January, one of the first to bring the new SoC Qualcomm to market. Can we expect a device with the screen between 5.2 and 5.5 inches with a resolution Quad HD, 3 or 4 GB of RAM and body made of metal with the neat design. The latest rumor points to a physical button below the screen Xiaomi Mi 5 that will house a biometric sensor company. Unfortunately, it seems it will not be this time that we will see SenseID ultrasonic technology from Qualcomm.